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High-Precision Tip-Tilt-R-Z Wafer Stage
Skills
Fusion 360 (Advanced Assembly), Technical Drawings & GD&T, Bearing & Preload Design, Tolerance Stack-Up, Structural Load Simulation (FEA), Cross-Functional Engineering Coordination
In a four-person bachelor thesis at KU Leuven, in cooperation with LAB Motion Systems, we designed a compact Tip-Tilt-R-Z stage for wafer inspection. We compared multiple architectures using functional decomposition and a value analysis, then selected a hexapod-based solution to reduce parasitic motion while keeping the system compact.
The final concept combines a frameless outrunner torque motor for continuous R-rotation, axial and radial air bearings for near-frictionless support, and a piezo-actuated hexapod to deliver lift and tip-tilt with high precision. I mainly worked on CAD and integration: designing and packaging key custom parts, defining tolerances for critical interfaces, and validating stiffness/deflection with Fusion 360 simulation.
Need for a Compact High-Precision Multi-DOF Stage
Conventional stacked-axis stages introduce parasitic motion, reduced dynamics, and increased system size, making them unsuitable for high-speed, high-precision wafer inspection.
Hexapod-Based Solution
Selected architecture combining a piezo-driven hexapod for tip–tilt and lift, air bearings for near-frictionless support, and a torque motor for continuous R-rotation.
Final Integrated Stage Design
Final CAD after multiple design iterations, converging to a compact multi-DOF architecture. Combines a hexapod-based actuation strategy with integrated rotation and lift, while meeting strict constraints on size (<300 mm), stiffness, and manufacturability.
Actuation and System Integration
Cross-sectional view highlighting full system integration of the torque motor (1), air bearings (3 & 4), piezo actuators (6), sensors (8), and structural components. Focus on tolerance stack-up, stiffness optimization, and cleanroom-compatible packaging to ensure precise alignment and minimal deformation under load.
Structural Optimization (FEA)
FEA-based stiffness and deformation analysis used to validate the design under load and guide geometry optimization for weight, rigidity, and uniform load transfer.
Manufacturing Drawings
Final manufacturing drawings defining tolerances, fits, and materials for all custom parts, making the design fully build-ready and ensuring precise assembly of critical interfaces.
Need for a Compact High-Precision Multi-DOF Stage
Conventional stacked-axis stages introduce parasitic motion, reduced dynamics, and increased system size, making them unsuitable for high-speed, high-precision wafer inspection.
Hexapod-Based Solution
Selected architecture combining a piezo-driven hexapod for tip–tilt and lift, air bearings for near-frictionless support, and a torque motor for continuous R-rotation.
Final Integrated Stage Design
Final CAD after multiple design iterations, converging to a compact multi-DOF architecture. Combines a hexapod-based actuation strategy with integrated rotation and lift, while meeting strict constraints on size (<300 mm), stiffness, and manufacturability.
Actuation and System Integration
Cross-sectional view highlighting full system integration of the torque motor (1), air bearings (3 & 4), piezo actuators (6), sensors (8), and structural components. Focus on tolerance stack-up, stiffness optimization, and cleanroom-compatible packaging to ensure precise alignment and minimal deformation under load.
Structural Optimization (FEA)
FEA-based stiffness and deformation analysis used to validate the design under load and guide geometry optimization for weight, rigidity, and uniform load transfer.
Manufacturing Drawings
Final manufacturing drawings defining tolerances, fits, and materials for all custom parts, making the design fully build-ready and ensuring precise assembly of critical interfaces.
Need for a Compact High-Precision Multi-DOF Stage
Conventional stacked-axis stages introduce parasitic motion, reduced dynamics, and increased system size, making them unsuitable for high-speed, high-precision wafer inspection.
Hexapod-Based Solution
Selected architecture combining a piezo-driven hexapod for tip–tilt and lift, air bearings for near-frictionless support, and a torque motor for continuous R-rotation.
Final Integrated Stage Design
Final CAD after multiple design iterations, converging to a compact multi-DOF architecture. Combines a hexapod-based actuation strategy with integrated rotation and lift, while meeting strict constraints on size (<300 mm), stiffness, and manufacturability.
Actuation and System Integration
Cross-sectional view highlighting full system integration of the torque motor (1), air bearings (3 & 4), piezo actuators (6), sensors (8), and structural components. Focus on tolerance stack-up, stiffness optimization, and cleanroom-compatible packaging to ensure precise alignment and minimal deformation under load.
Structural Optimization (FEA)
FEA-based stiffness and deformation analysis used to validate the design under load and guide geometry optimization for weight, rigidity, and uniform load transfer.
Manufacturing Drawings
Final manufacturing drawings defining tolerances, fits, and materials for all custom parts, making the design fully build-ready and ensuring precise assembly of critical interfaces.
Need for a Compact High-Precision Multi-DOF Stage
Conventional stacked-axis stages introduce parasitic motion, reduced dynamics, and increased system size, making them unsuitable for high-speed, high-precision wafer inspection.
Hexapod-Based Solution
Selected architecture combining a piezo-driven hexapod for tip–tilt and lift, air bearings for near-frictionless support, and a torque motor for continuous R-rotation.
Final Integrated Stage Design
Final CAD after multiple design iterations, converging to a compact multi-DOF architecture. Combines a hexapod-based actuation strategy with integrated rotation and lift, while meeting strict constraints on size (<300 mm), stiffness, and manufacturability.
Actuation and System Integration
Cross-sectional view highlighting full system integration of the torque motor (1), air bearings (3 & 4), piezo actuators (6), sensors (8), and structural components. Focus on tolerance stack-up, stiffness optimization, and cleanroom-compatible packaging to ensure precise alignment and minimal deformation under load.
Structural Optimization (FEA)
FEA-based stiffness and deformation analysis used to validate the design under load and guide geometry optimization for weight, rigidity, and uniform load transfer.
Manufacturing Drawings
Final manufacturing drawings defining tolerances, fits, and materials for all custom parts, making the design fully build-ready and ensuring precise assembly of critical interfaces.
Need for a Compact High-Precision Multi-DOF Stage
Conventional stacked-axis stages introduce parasitic motion, reduced dynamics, and increased system size, making them unsuitable for high-speed, high-precision wafer inspection.
Hexapod-Based Solution
Selected architecture combining a piezo-driven hexapod for tip–tilt and lift, air bearings for near-frictionless support, and a torque motor for continuous R-rotation.
Final Integrated Stage Design
Final CAD after multiple design iterations, converging to a compact multi-DOF architecture. Combines a hexapod-based actuation strategy with integrated rotation and lift, while meeting strict constraints on size (<300 mm), stiffness, and manufacturability.
Actuation and System Integration
Cross-sectional view highlighting full system integration of the torque motor (1), air bearings (3 & 4), piezo actuators (6), sensors (8), and structural components. Focus on tolerance stack-up, stiffness optimization, and cleanroom-compatible packaging to ensure precise alignment and minimal deformation under load.
Structural Optimization (FEA)
FEA-based stiffness and deformation analysis used to validate the design under load and guide geometry optimization for weight, rigidity, and uniform load transfer.
Manufacturing Drawings
Final manufacturing drawings defining tolerances, fits, and materials for all custom parts, making the design fully build-ready and ensuring precise assembly of critical interfaces.
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